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International Congress on Sound and Vibration 2017 (ICSV25)

This congress will be held in Hiroshima, Japan, from 8 to 12 July 2018. The ICSV is a leading event in the area of acoustics and vibration and provides an important opportunity for scientists and engineers to share their latest research results and exchange ideas on theories, technologies and applications in these fields. As in previous years, the ICSV25 will feature a broad range of technical papers from across the world. The deadline for abstract submission is 1 December 2017. Peer review of contributed papers is available as an option selected by the author.

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